SAEJONG IND.

LED POTTING

• Fluid type : EPOXY + PHOSPHOR

HYBRIDE BATTERY SEALING

• Fluid type : SILICONE

SEALING

• Fluid type : SILICONE, EPOXY, etc.

MOLDING

• Fluid type : SILICONE, EPOXY, etc.

PATTERN DISPENSING

• Fluid type : UV RESIN

WIDE DISPENSING

• Fluid type : UV RESIN

JUNCTION BOX SEALING

• Fluid type : SILICONE

JUNCTION BOX POTTING

• Fluid type : SILICONE, TWIN MIXING SILICONE

SIDE SEALING SYSTEM

• Fluid type : SILICONE, BUTYL

FRAME SEALING SYSTEM

• Fluid type : SILICONE

FRIT GLASS BOND SEALING

• Fluid type : FRIT (GLASS BOND)
• PDP GLASS PANEL attachment / LCD BLU PANEL attachment

TFT LCD TAP SILICON SEALING

• Fluid type : FRIT (GLASS BOND)
• PDP GLASS PANEL attachment / LCD BLU PANEL attachment

UV SILICON LCD ADHESIVE

• Fluid type : UV SILICON
• TFT LCD-COG DISPENSING
• UV COATING DISPENSING

EPOXY FILLING

• Fluid type : 1 PART EPOXY
• 1 part epoxy molding in Electrolytic condenser

POT DISPENSING

• Fluid type : 1 PART UV EPOXY

Dispensing instant adhesives on key pad

• Fluid type : instant adhesive
• Mobile phone key pad attachment

Multiple dispensing instant adhesives on key pad

• Fluid type : instant adhesive
• Mobile phone key pad attachment

Low viscosity silicon

• Fluid type : Low viscosity silicon
• Silicone dispensing around chip on PDP PCB Board to prevent humidity

Lead frame chip bonding with epoxy

• Faster tact time by in line machine

Camera module (CMOS)

• IR Filter attachment (UV bond dispensing)
• HOUSING (EPOXY dispensing)

Low viscosity silicon

• Applicable machine : Rotary unit

EMI

• Sealing electric conductible liquid on mobile phone case lid to isolate electromagnetic wave for mobile phone gasket
• Enable mass production in a short tact time with 5 axis multi head